Requirements in the semiconductor and electronic cooling markets are being constantly pushed as companies seek extra performance from processors and battery systems.
This creates increased heat loads and, as the returns have diminished with traditional technology solutions, future focused companies are turning to AM for solutions.
At Conflux, we bring significant improvements over the incumbent solutions that deliver compelling performance for the microelectronics industry.
The need to cool in increasingly complex and constrained spaces is becoming a reality in the electronics and battery markets. Space can often be a constraint, with parts required to fit within existing assemblies that provide narrow packaging options for new cooling solutions. AM allows Conflux the freedom to create complex geometries that can provide increased performance within existing systems.
AM provides unique opportunities to increase the performance of components with geometries not achievable with traditional manufacturing methods.
At Conflux, this means creating innovative ways to increase the performance of heat exchangers through a combination of AM-enabledthree dimensional surface geometries and an ever present drive for thinner walls.
We have developed a range of fundamental geometries that form the basis of our approach to the design of heat exchangers.
Speak to us today about how we can solve your challenges and enhance application performance
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